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Patent Abstract
A jewelry setting and method for manufacturing same are provided.
The jewelry setting includes a frame configured to receive a gemstone,
the frame including a base and at least one sidewall defining a
cavity for receiving the gemstone; and at least two prongs soldered
to the at least one sidewall, wherein the at least two prongs extend
above an upper peripheral edge of the sidewall for securing the
gemstone in the frame. The method includes the steps providing the
frame configured to receive the gemstone; providing at least two
prongs, each of the at least two prongs includes a layer of solder
disposed thereon; placing the at least two prongs in contact with
the at least one sidewall of the frame; and heating the frame and
the prongs to a predetermined temperature, wherein the solder will
reflow and form a joint between the prongs and the sidewall.
Patent Claims
1. A jewelry setting comprising: a frame configured to receive a
gemstone, the frame including a base and at least one sidewall defining
a cavity for receiving the gemstone; and at least two prongs soldered
to the at least one sidewall, wherein the at least two prongs extend
above an upper peripheral edge of the at least one sidewall for
securing the gemstone in the frame.
2. The jewelry setting as in claim 1, wherein the base of the frame
includes at least one aperture.
3. The jewelry setting as in claim 1, wherein the at least two
prongs are bent inwardly toward a center of the frame at a predetermined
distance above the upper peripheral edge of the at least one sidewall.
4. The jewelry setting as in claim 1, further comprising a retainer
member configured to center the received gemstone in the frame,
the retainer member being disposed on the upper peripheral edge
of the at least one sidewall.
5. The jewelry setting as in claim 4, wherein the retainer member
is flat.
6. The jewelry setting as in claim 4, wherein the retainer member
is configured with an inwardly down-sloping angle.
7. The jewelry setting as in claim 1, wherein each of the at least
two prongs has a generally square cross-section.
8. The jewelry setting as in claim 1, wherein each of the at least
two prongs includes a generally rectangular portion for mating with
the at least one sidewall and two prong members extending from the
rectangular portion for gripping the received gemstone.
9. The jewelry setting as in claim 1, wherein the shape of the
frame generally corresponds to a shape of the gemstone.
10. The jewelry setting as in claim 4, wherein the shape of the
retainer member generally corresponds to a shape of the gemstone.
11. The jewelry setting as in claim 1, further comprising a post
soldered to an underside of the base of the frame.
12. The jewelry setting as in claim 1, wherein the at least one
sidewall includes at least one cutout for exposing a lower portion
of the gemstone received by the frame.
13. The jewelry setting as in claim 12, further comprising a retainer
member configured to center the received gemstone, the retainer
member being disposed on the upper peripheral edge of the at least
one sidewall.
14. A method for manufacturing a jewelry setting, the method comprising
the steps: providing a frame configured to receive a gemstone, the
frame including a base and at least one sidewall defining a cavity
for receiving the gemstone; providing at least two prongs, each
of the at least two prongs includes a layer of solder disposed thereon;
placing the at least two prongs in contact with the at least one
sidewall of the frame; and heating the frame and the at least two
prongs to a predetermined temperature, wherein the solder will reflow
and form a joint between each of the at least two prongs and the
at least one sidewall.
15. The method as in claim 14, further comprising the steps: disposing
a gemstone in the frame; and bending an upper portion of each of
the at least two prongs inwardly relative to the frame to secure
the gemstone in the frame.
16. The method as in claim 14, further comprising the steps: before
the heating step, providing a retainer member for centering the
received gemstone, the retainer member including a layer of solder
disposed thereon and disposing the retainer member on an upper peripheral
edge of the at least one sidewall.
17. The method as in claim 16, further comprising the steps: after
the heating step, disposing a gemstone on the retainer member; and
bending an upper portion of each of the at least two prongs inwardly
relative to the frame to secure the gemstone in the frame.
18. The method as in claim 14, wherein the at least two prongs
include an upper bent portion, the placing step further comprising
the step disposing a gemstone in the frame, the upper bent portions
contacting an upper portion of the gemstone and a lower portion
of the at least two prongs contacting the at least one sidewall
of the frame.
19. The method as in claim 14, wherein the at least two prongs
include an upper bent portion, further comprising the steps: providing
a retainer member including a layer of solder; disposing the retainer
member on an upper peripheral edge of the at least one sidewall
of the frame; disposing a gemstone on the retainer member; and placing
the upper bent portions in contact with an upper portion of the
gemstone and a lower portion of the at least two prongs in contact
with the at least one sidewall of the frame.
20. The method as in claim 16, further comprising the step providing
a post including a solder disposed on at least one end and placing
the at least one end of the post in contact with an underside of
the base of the frame before the heating step.
Patent Description
PRIORITY
[0001] This application claims priority to an application entitled
"JEWELRY SETTING" filed in the United States Patent and
Trademark Office on Oct. 20, 2005 and assigned Ser. No. 60/728,729,
the contents of which are hereby incorporated by reference.
BACKGROUND
[0002] 1. Field
[0003] The present disclosure relates to jewelry findings, and
more particular, a jewelry setting which provides maximum exposure
of a gemstone, while providing a sturdy and attractive mounting
for the gemstone. The jewelry setting may be incorporated in a ring,
an earring, a pendant, or as a component of a bracelet and the like.
[0004] 2. Description of the Related Art
[0005] Jewelry findings are well known in the art and have been
the subject of many issued patents. For example, U.S. Pat. No. 2,835,117
which issued to Lutrario on May 20, 1958 is entitled "GEM SETTING
WITH GEM BIASED ORNAMENTAL SADDLE MEMBER", and discloses a
significant and massive gold setting construction, thereby shielding
a large portion of the gemstone. Similarly, the patent to Engel,
U.S. Pat. No. 2,510,774 which issued on Jun. 6, 1950 provides a
stone mounting for bracelets and other articles wherein a major
portion of the sides of the gemstone are hidden. Other similar findings
or settings which obstruct a portion of the gemstone are disclosed
in U.S. Pat. No. 5,433,090 to Santiago which issued on Jul. 18,
1995 and is entitled "VARIABLE FINGER RING WITH BIASED SHANK
AND METHOD OF MAKING SAME" and U.S. Pat. No. 5,800,574 to Ricci
et al. which issued on Sep. 1, 1998 and is entitled "V-END
SETTINGS AND METHOD OF MAKING SAME".
[0006] Even applicant's U.S. Pat. No. 6,453,701 which issued on
Sep. 24, 2002 and is entitled "MULTI-PART JEWELRY SETTING"
provides an aesthetically pleasing setting that appears to be of
significant and massive gold construction whereas, in fact, applicant's
patented setting is hollow and relatively inexpensive, as compared
to its appearance which is expensive-looking.
[0007] Although applicant's patented jewelry setting, as well as
the other prior art settings have been well received in the marketplace,
it is desirable to provide a setting which is sturdy, yet of minimal
structure, thereby affording full exposure of the gemstone, not
only on the top portion thereof, but along its sides, thereby providing
an even more aesthetically pleasing jewelry.
[0008] Accordingly, it is an object of the subject disclosure to
provide a jewelry setting, which provides maximum exposure of a
gemstone disposed in the setting, while at the same time providing
a sturdy mounting for the gemstone.
[0009] It is a further object of the subject disclosure to provide
a jewelry setting which may be used with gemstones that are capable
of being subjected to soldering temperatures in the range of 1,400.degree.
F. during mounting of the gemstone to the setting, as well as providing
a stone setting which may be readily employed with gemstones that
cannot be subjected to such elevated temperatures.
SUMMARY
[0010] The above and other objects are achieved by a jewelry setting
or finding in accordance with the present disclosure wherein a very
thin frame corresponding to a shape of a gemstone is provided, with
an outer diameter of the frame substantially corresponding to an
outer perimeter of the stone, whereby the stone may be placed on
an upper peripheral edge of the frame and centered thereon. Next,
prongs of generally square-shaped, cross-section are soldered to
the peripheral sidewalls of the frame so as to extend above the
surface of the gemstone, after which the prongs are bent radially
inwardly, thereby establishing a sturdy setting for the stone, while
affording maximum exposure of the stone thereby resulting in an
aesthetically pleasing stone setting.
[0011] According to one aspect of the present disclosure, a jewelry
setting is provided. The jewelry setting includes a frame configured
to receive a gemstone, the frame including a base and at least one
sidewall defining a cavity for receiving the gemstone; and at least
two prongs soldered to the at least one sidewall, wherein the at
least two prongs extend above an upper peripheral edge of the at
least one sidewall for securing the gemstone in the frame. Each
of the at least two prongs has a generally square cross-section.
[0012] In another aspect of the present disclosure, the jewelry
setting further includes a retainer member configured to center
the received gemstone in the frame, the retainer member being disposed
on the upper peripheral edge of the at least one sidewall. The retainer
member may be flat or configured with an inwardly down-sloping angle.
[0013] In a further aspect, each of the at least two prongs includes
a planar generally rectangular portion for mating with the at least
one sidewall and two prong members extending from the rectangular
portion for gripping the received gemstone.
[0014] In another aspect, the frame includes at least one cutout
for exposing a lower portion of the gemstone received by the frame.
[0015] According to another aspect of the present disclosure, a
method for manufacturing a jewelry setting is provided. The method
includes the steps providing a frame configured to receive a gemstone,
the frame including a base and at least one sidewall defining a
cavity for receiving the gemstone; providing at least two prongs,
each of the at least two prongs includes a layer of solder disposed
thereon; placing the at least two prongs in contact with the at
least one sidewall of the frame; and heating the frame and the at
least two prongs to a predetermined temperature, wherein the solder
will reflow and form a joint between each of the at least two prongs
and the at least one sidewall. The method further includes the steps
disposing a gemstone in the frame; and bending an upper portion
of each of the at least two prongs inwardly relative to the frame
to secure the gemstone in the frame.
[0016] In another aspect, the method further includes the steps,
before the heating step, providing a retainer member for centering
the received gemstone, the retainer member including a layer of
solder disposed thereon and disposing the retainer member on an
upper peripheral edge of the at least one sidewall.
[0017] In a further aspect of the present disclosure, the method
includes, wherein the at least two prongs include an upper bent
portion, the placing step further includes the step disposing a
gemstone in the frame before the heating step, the upper bent portions
contacting an upper portion of the gemstone and a lower portion
of the at least two prongs contacting the at least one sidewall
of the frame.
BRIEF DESCRIPTION OF THE DRAWINGS
[0018] The above and other aspects, features, and advantages of
the present disclosure will become more apparent in light of the
following detailed description when taken in conjunction with the
accompanying drawings in which:
[0019] FIG. 1 is an exploded perspective view of a finding according
to the present disclosure, along with a round stone which is capable
of being heated to a soldering temperature.
[0020] FIG. 2 is a side elevational view of the assembly of the
finding and stone as illustrated in FIG. 1.
[0021] FIG. 3 is a perspective view of the assembly of the subject
finding and stone of FIG. 2.
[0022] FIG. 4 is an exploded perspective view of a finding employing
a retainer member according to the present disclosure.
[0023] FIG. 5 is a side elevational view of the assembly of the
finding and stone as illustrated in FIG. 4.
[0024] FIG. 6 is a perspective view of the assembly of the subject
finding and stone of FIG. 5.
[0025] FIG. 7 is an exploded perspective view of another embodiment
of a finding according to the present disclosure which is designed
to hold a round stone that is not capable of being heated to soldering
temperatures.
[0026] FIG. 8 is side elevational view of the finding of FIG. 7
preparatory to receiving a stone.
[0027] FIG. 9 is a top perspective view of the finding of FIG.
8.
[0028] FIG. 10 is a perspective view of the finding of FIG. 8.
[0029] FIG. 11 is an exploded perspective view of a further embodiment
of the present disclosure.
[0030] FIG. 12 is a perspective view of the assembly of the subject
finding and stone of FIG. 11.
[0031] FIG. 13 is an exploded perspective view of a finding according
to the present disclosure, along with a square stone which is capable
of being heated to a soldering temperature.
[0032] FIG. 14 a top perspective view of the assembly of the subject
finding and stone of FIG. 13.
[0033] FIG. 15 is a side elevational view of the assembly of the
finding and stone as illustrated in FIG. 14.
[0034] FIG. 16 is a perspective view of the assembly of the subject
finding and stone of FIG. 15.
[0035] FIG. 17 is an exploded perspective view of another embodiment
of a finding according to the present disclosure which is capable
of accommodating a square stone.
[0036] FIG. 18 is top perspective view of the assembly of the finding
of FIG. 17.
[0037] FIG. 19 is a perspective view of the finding of FIG. 18.
[0038] FIG. 20 is an exploded perspective view of a further embodiment
of the present disclosure, which finding is designed to hold a round
stone which is capable of being heated to soldering temperatures,
and where the finding includes a post.
[0039] FIG. 21 is perspective view of the assembly of the finding
and stone of FIG. 20.
[0040] FIG. 22 is an exploded perspective view of another embodiment
of the present disclosure, which finding is designed to hold a round
stone which is not capable of being heated to soldering temperatures,
and where the finding includes a post.
[0041] FIG. 23 is perspective view of the finding of FIG. 22 preparatory
to receiving a round stone.
[0042] FIG. 24 is an exploded perspective view of a further embodiment
of the present disclosure, which finding is designed to hold a round
stone which is not capable of being heated to soldering temperatures,
and where the finding includes a post.
[0043] FIG. 25 is perspective view of the assembly of the finding
and stone of FIG. 24.
[0044] FIG. 26 is a side elevational view of an assembly of the
finding and cabochon stone employing a flat retainer member.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0045] Preferred embodiments of the present disclosure will be
described hereinbelow with reference to the accompanying drawings.
In the following description, well-known functions or constructions
are not described in detail to avoid obscuring the present disclosure
in unnecessary detail.
[0046] Turning to FIG. 1, the subject setting or finding 1 comprises
a cylindrical frame 12 for receiving a gemstone and a plurality
of prongs 14 which include bent portions 15 for gripping of the
stone 10. The cylindrical frame 12 includes an annular sidewall
16 and an open bottom or base, designated by the numeral 18, defining
a cavity for receiving the gemstone. The aperture defining by the
base 18 can be of any size and may vary in accordance with the stone
selected for a particular setting. An upper peripheral edge 20 of
the cylindrical frame substantially corresponds to an outer diameter
of the round stone 10. The prongs 14 are soldered to the sidewall
16 of the cylindrical frame 12, as shown in FIGS. 2 and 3, with
the prongs 14 being equally spaced about the perimeter of the cylindrical
frame 12.
[0047] As shown in FIGS. 2 and 3, the stone 10 rests on the upper
peripheral edge 20 of the cylindrical frame 12 of the setting, with
the bent portions 15 of the prongs 14 engaging and tightly holding
the stone 10 to the finding.
[0048] As illustrated in FIGS. 2 and 3, the peripheral portion
11 of the stone 10, e.g. a girdle, is fully exposed, as is the top
portion of the stone 10, other than for the small protrusions of
the bent portions 15 of the prongs 14. Accordingly, maximum exposure
of the stone 10 is effected, thereby resulting in an aesthetically
pleasing assembly of the stone and the subject finding.
[0049] The frame 12 may be formed from any precious or non-precious
metal by any known metal forming process, e.g., a stamping process,
to correspond to the shape of the gemstone to be set, e.g., round,
oval, square, triangle, emerald, pear, marquise, heart, etc.
[0050] Each prong 14 has a generally square cross-sectional configuration,
of approximate one half millimeter on each side, and is preferably
made of the same metal or material as is the cylindrical frame 12,
e.g. gold, silver, platinum, etc.. The prongs are manufactured as
a generally square wire which is cut into desired lengths. The wire
includes a layer of solder around and along an entire length of
the wire. Preferably, the color of solder will approximately match
the color of the setting, i.e., the frame and prongs.
[0051] It is to be appreciated that the wire may be of other shapes
to effect different looks of the setting. For example, the wire
may be circular and cut to the desired length. The cut lengths of
the wire will vary and will depend on the size and/or the shape
of the stone to be set.
[0052] In the assembly of the stone and finding as shown in the
embodiment of FIGS. 1-3, the stone 10 is placed on the cylindrical
frame 12 so as to engage the upper peripheral edge 20, and because
of this configuration, the stone 10 is essentially self-centered.
Next, the cylindrical frame 12, the stone 10, and the prongs 14
are arranged as shown in FIG. 2 and placed in a suitable jig for
holding the assembly. As shown in FIG. 2, a lower portion 13 of
the prong will be placed in contact with the sidewall 16 and the
bent portion 15 of the prong will be placed in contact with an upper
portion of the stone above the peripheral portion 11 of the stone
10. The finding assembly will then be subjected to a sufficient
predetermined temperature, e.g., on the order of 1,400.degree. F.,
so as to solder the prongs 14 to the frame 12, e.g., to allow the
solder to reflow and form a joint between the prongs and the frame,
and to provide a sturdy grip by the bent portions 15 of the prongs
14 against the upper portion of the stone, thereby resulting in
the assembled stone and finding as shown in FIG. 3. By this arrangement,
the objective of obtaining maximum exposure of the stone is achieved,
at a cost less than the cost of existing findings.
[0053] It is to be appreciated that in assembling the setting of
FIGS. 1-3, the gemstone 10 employed must be able to withstand high
temperatures without becoming damaged. The lowest tolerable temperature
of the gemstone must be at least a predetermined amount of degrees
higher than the melting point, or reflow temperature, of the solder
being employed. Furthermore, the melting point of the solder must
be lower than a melting point of the metal of frame 12.
[0054] In a further embodiment, a retainer member is employed to
center the gemstone received in the frame. Referring to FIGS. 4-6,
a retainer member is generally designated by reference numeral 22.
In this embodiment, the retainer member 22 is annular shaped and
has an outer circumference 24 corresponding to the upper peripheral
edge 20 of the frame 12. The retainer member 22 is formed with a
layer of solder for bonding the retainer member 22 to the frame.
The setting shown in FIGS. 4-6 will be assembled as described above
with the further step of disposing the retainer member 22 on the
frame 12 before disposing the stone on the frame. By employing the
retainer member 22, a gemstone having a girdle circumference 11
less than the circumference of the frame may be used in the setting
1 of the present disclosure.
[0055] It is to be appreciated that other shapes and configurations
of the retainer member may be employed depending on the size and/or
shape of the stone to be set, i.e., a shape of the retainer member
will substantially correspond to the shape of the stone, e.g., square,
oval, etc.. In the embodiments shown in FIGS. 4-6, the retainer
member is configured with an inwardly down-sloping angle best suited
for faceted stones. Another exemplary retainer member will include
a flat annular ring 130 which will be disposed on the upper peripheral
edge 20 of the frame 12 as shown in FIG. 26. In this embodiment,
the stone 132 will rest on the retainer member 130 whereby virtually
no part of the stone 132 will be disposed in the frame 12 to effect
full exposure of the stone. Such a retainer member might be employed
with a cabochon stone. The prongs 134 will securely hold the stone
in place as described in the various embodiments.
[0056] In another embodiment of the present disclosure, the setting
30 is designed to be used with a stone that is not capable of being
subjected to elevated temperatures for soldering the prongs 34 to
the frame 32. In the embodiment of FIG. 7, the finding 30 includes
a retainer member 36 which is soldered to the upper peripheral edge
38 of the frame 32, at the same time that the prongs 34 are soldered
to the frame 32. The resulting finding 30 is illustrated in FIGS.
8, 9 and 10. In this embodiment, the prongs 34 are straight and
are not formed with bent portions as in the embodiment of FIG. 1.
[0057] The straight leg prongs 34 are soldered to the frame 32
without the bent portions so a gemstone may be set in the frame
after the soldering has taken place. Since the prongs 34 have solder
on all sides, the prongs may be placed in the jig with any side
of the prong coming into contact with the frame 32, allowing quick
and easy placement of the components into the jig without having
to determine which side of the prong has solder disposed on it.
After the retainer ring 36 and the prongs 34 are soldered to the
frame 32 as described above and illustrated in FIGS. 8-10, a stone
is placed on the retainer ring 36, and is self-centered, after which
the prongs 34 are bent inwardly to firmly grip the stone. The prongs
may be bent to grip the stone by a modified drill press such as
the DP-30 Drill Press commercially available from The Foredom Electric
Company of Bethel, Conn. The resulting setting with gemstone in
place is similar to that shown in FIG. 6.
[0058] Referring to FIGS. 11 and 12, another embodiment of the
jewelry setting of present disclosure is illustrated. Here, the
setting 40 includes a cylindrical frame 42 including a sidewall
44 and a bottom or base 46 with an aperture, a retainer member 48
and two prongs 50. Each prong 50 includes a generally rectangular
portion 52 for mating with the sidewall 44 and two prong members
54 for securely gripping a gemstone received in the frame 42. The
rectangular portion 52 will be curved to substantially correspond
to the curvature of sidewall 44 so when mated the rectangular portion
52 is in full contact with sidewall 44 which in turn will form a
stronger joint during the soldering step. In FIG. 11, the prong
members 54 include a bent portion 56 and will be utilized with gemstones
that can withstand the high temperatures of the soldering process.
It is to be appreciated the prongs 50 can be manufactured with straight
prong members 54 wherein the prongs 50 will be soldered to the frame
42 without the gemstone in place and, after the gemstone is received
in the setting, the prong members 54 will be bent inward to secure
the gemstone. In either case, the resulting setting with gemstone
in place is illustrated in FIG. 12.
[0059] Turning to FIG. 13, a further embodiment of the subject
setting 60 is designed to accommodate square stones, and includes
a square-shaped frame 62 and a plurality of prongs 64. Each of the
plurality of prongs 64 includes a bent portion 66. In assembling
the setting 60, a square stone is placed on the upper peripheral
rim 68 of the frame 62 so as to be self-centered, after which the
frame 62 and the prongs 64 are placed in a suitable jig. The assembly
is subjected to a high temperature for soldering the prongs 64 to
the frame 62. The assembly of the prongs 64 to the frame 62 is illustrated
in FIGS. 14-16.
[0060] In a further related embodiment, the prongs 70 are straight
as illustrated in FIGS. 17-19. In this embodiment, a retainer member
72 is employed. Although shown as having an inwardly down-sloping
angle, the retainer member 72 may be flat for a stone with a flat
bottom so no portion of the gemstone is inside the frame and is
therefore fully exposed. In assembling the setting 60, the frame
62, prongs 70 and retainer member 72 are placed in a suitable jig,
after which the assembly is subjected to a high temperature for
soldering the prongs 70 and retainer member 72 to the frame 62.
Thereafter, a square stone is placed on the upper peripheral rim
68 of the frame 62 where the retainer member 72 sits so as to be
self-centered and the prongs 70 are bent inwardly to grip the stone
by a suitable drill press as described above.
[0061] Turning to FIG. 20, a further embodiment of the subject
setting 80 is designed to be employed as an earring. The setting
80 includes a generally cylindrically shaped frame 82, a plurality
of prongs 88 and a retainer member 90. The frame 82 includes a sidewall
84 and a spherical shaped bottom 86. Each of the plurality of prongs
88 includes a bent portion 92. The setting further includes a post
94 which will be soldered to an underside of the bottom 86 of the
frame 82. In assembling the setting 80, the frame 82 and retainer
member 90 are placed in a suitable jig, after which a stone 96 is
placed on the upper peripheral rim of the retainer member 90 so
as to be self-centered. The prongs 88 are then placed in the jig,
after which the assembly is subjected to a high temperature for
soldering the prongs 88 and retainer member 90 to the frame 82.
Next, the post 94 is soldered to the frame 82. The assembly of the
prongs 88 to the frame 82 with stone in place is illustrated in
FIG. 21.
[0062] FIGS. 22 and 23 illustrate another embodiment of the setting
or finding of the present disclosure, which embodiment is designated
by the numeral 100.
[0063] Setting 100 is also designed to accommodate stones which
are not capable of being subjected to elevated soldering temperatures,
with the setting 100 including a frame 102, retaining member or
ring 104 and straight leg prongs 106, as well as a post 108. As
described above, the retainer member 104 and prongs 106 will be
provided with a layer of solder colored to match the color of the
frame 102. The frame 102, retainer member 104, prongs 106 and post
108 will be assembled in a suitable jig and subjected to an elevated
temperature to allow the solder to reflow and join the components
together. The assembled setting 100 is illustrated in FIG. 23.
[0064] After the setting 100 is assembled, a stone is placed on
the frame 102, and then the prongs 106 are bent radially inwardly
to grip the stone as described above.
[0065] Turning to FIG. 24, a further embodiment of the subject
setting 110 is illustrated. The setting 110 includes a generally
cylindrically shaped frame 112, a plurality of prongs 114 and a
retainer member 116. The frame 112 includes at least one sidewall
118 and a spherical shaped bottom 120. The sidewall 118 includes
at least two cutouts 122 for exposing a bottom portion of the gemstone.
In the illustrated non-limited embodiment, the frame 112 has three
cutouts resulting in three sidewalls 118. It is to be appreciated
the number of cutouts and sidewalls may vary based on the size and
shape of the gemstone.
[0066] The setting further includes a post 126 which will be soldered
to an underside of the bottom 120 of the frame 112.
[0067] In assembling the setting 110, the frame 112, prongs 114,
retainer member 116 and post 126 are placed in a suitable jig, after
which the assembly is subjected to a high temperature for soldering
the prongs 114, retainer member 116 and post 126 to the frame 112.
After a gemstone is disposed on the retainer member 116, the prongs
114 will be bent by a suitable drill press at a portion of the prong
above the girdle of the gemstone to secure the gemstone in place.
The assembly of the prongs 114 to the frame 112 is illustrated in
FIG. 25. In other embodiments, the assembly could be made without
the post 126 which could be soldered to the frame at a later time
by applying solder paste to one end of the post.
[0068] It is to be appreciated that the setting 110 may employ
prongs with an upper bent portion as described in the various embodiments
above. In assembling the setting 110 with bent prongs, the frame
112, retainer member 116 and post 126 are placed in a suitable jig,
after which a stone 128 is placed on the upper peripheral rim of
the retainer member 116 so as to be self-centered. The prongs with
upper bent portions (not shown) are then placed in the jig, after
which the assembly is subjected to a high temperature for soldering
the prongs, retainer member 116 and post 126 to the frame 112. The
assembly of the prongs to the frame 112 with stone in place is illustrated
in FIG. 25. As can be seen, whether straight prongs or bent prongs
are used, the resulting setting after gemstone placement is the
same.
[0069] In all of the embodiments of the subject disclosure, the
resulting finding ensures maximum exposure of the stone including
maximum exposure of the peripheral side edges of the stone, as well
as providing an inexpensive, but sturdy finding for griping of the
stone.
[0070] While the disclosure has been shown and described with reference
to certain preferred embodiments thereof, it will be understood
by those skilled in the art that various changes in form and detail
may be made therein without departing from the spirit and scope
of the disclosure as defined by the appended claims. |